Congo Basin Group
Liquid Soldering Flux - No-Clean Flux for SMD, BGA, IC & PCB Repair
Liquid Soldering Flux - No-Clean Flux for SMD, BGA, IC & PCB Repair
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Make soldering and electronics repair easier with HXP-105 Liquid Flux, designed for SMD, BGA, IC, PCB, battery, and metal soldering applications. The convenient dropper bottle allows controlled application, helping flux reach the areas you need for smoother, faster soldering. Its formula contains 50% water, 30% active agent, and 20% antioxidant, with no added Bi. Suitable for materials including 18650 battery cells, galvanized sheet, stainless steel, copper, iron, and battery nickel sheets. REACH certified for added product assurance.
How to Use: Clean the area to be soldered, apply a small amount of flux, then begin soldering. After completing the repair, clean the work surface as appropriate.
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